Description
- Si3N4 Film coated by low stress LPCVD method
- Si3N4 Thickness: 1.3um +/- 5%
-
Si3N4 covers both side on Corning 7980 0F fused silica ( Warning: the Si3N4 film may have stressed induced micro-cracking resulted from the large difference of thermal expansion coefficient between Si3N4 and SiO2 fused silica )
• UV Grade Fused Silica (Corning 0F 7980 HPFS)
• Size: 10x5x0.5mm
• Edge: CNC Ground
• Surface Quality: 60/40 or beer
• Non-effective Area: 2.0 mm border
• TTV: < 20 microns
• Polishing: Two sides polished (60/40)
• Average Surface Roughness Ra: =< 5 A RMS
-
Optional: you may need tool below to handle the wafer ( click picture to order )
Related Products
