Description
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RSA 6061 ( Al Si0.5 Cu0.3 mg1.1) Substrate supplied by RSP Technology
Very fine nanostructured alloys (polycrystalline with fine grain) with new functionalities, generated by using Meltspinning process, ultra fast cooling rates with converting more than 1 million degrees per second. -
Density: 2.7 gram/cm^3
For the detailed physical, mechanical properties and other information please refers to www.rsp-technology.com
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Substrate dimension: 10x10 x 0.5 mm
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Polishing: One side polished
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Surface roughness: < 5A RMS