Plastic Foam Module Wafer Carrier for Single 4" Wafer (SP4-12012T/BK)

Plastic Foam Module Wafer Carrier for Single 4" Wafer (SP4-12012T/BK)

RM0.00 MYR
RM0.00 MYR
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Plastic Foam Module Wafer Carrier for Single 4" Wafer (SP4-12012T/BK)
  • Plastic Foam Module Wafer Carrier for Single 4" Wafer (SP4-12012T/BK)
Plastic Foam Module Wafer Carrier for Single 4" Wafer (SP4-12012T/BK)

Plastic Foam Module Wafer Carrier for Single 4" Wafer (SP4-12012T/BK)

SKU: plastic-foam-module-wafer-carrier-for-single-4-wafer-sp4-12012t-bk

Price: RFQ

Description

 Plastic Foam Module Wafer Carrier is a solution for valued and fragile devices. This packing is designed to protect delicate parts during transport, processing, inspection and assembly. Also it has been applied largely in many fields like optical materials, opto-electonic components, semiconductor, and optical communication. The structure consists of three cushions, the middle cushion called module cushion can be customized to specific shape to hold the devices exactly and safely. The inner foam and outer foam are both made with anti-static IXPE Conductive Foam. The top plastic case is made with polycarbonate, while the bottom plastic case is made with ABS.

Plastic Foam Module Wafer Carrier is a solution for valued and fragile devices. This packing is designed to protect delicate parts during transport, processing, inspection and assembly. Also it has been applied largely in many fields like optical materials, opto-electonic components, semiconductor, and optical communication. The structure consists of three cushions, the middle cushion called module cushion can be customized to specific shape to hold the devices exactly and safely.

The inner foam and outer foam are both made with anti-static IXPE Conductive Foam. The top plastic case is made with polycarbonate, while the bottom plastic case is made with ABS. 
Specifications

TYPE:                      SP4-12012T/BK
Inside Dimension:      4 " diameter
Outside Dimension:   120mm x 120mm x 12mm
Color:                       Cover:Transparent/Body:black.

Module Structure in box: double 4" diameter foam insert modules are included and suitable for packing single wafer
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