Description
Substrate Specifications:
- Wafer Size: 10 x 10 x 0.5 mm thickness +/-0.05 mm
- Wafer Orientation: (111) +/-0.5 Deg
- Polishing: One side CMP polished with free sub-surface damaged
- Surface finish (RMS or Ra) : < 10A
- Package: Under 1000 class clean room, and in 100 grade plastic bag in a wafer container.
- Lattice Constant a=3.792Å Pseudo cubic
- Warning: LaAlO3 crystal has a visible twin on a polished surface, which is normal nature .
| LaAlO3 | SrTiO3 | ||||
|
|
|||||
 |
