Description
Specifications
- Growing Method: CZ
- Wafer Size: 5x5x0.4 mm
- Surface Polishing: one side epi polished
- Orientation: (100)
- Surface roughness: < 8 A (by AFM)
- Doping: Undoped
- Conductor type: N-type
- Resistivity: >50 Ohms/cm (If you would like to measure the resistivity accurately, please order our Portable 4 Probe Resistivity Testing Instrument.)
- Package: under 1000 class clean room in wafer container
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