Description
- Composition: Bismuth Iron Oxide BiFeO3 Target
- 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)
- Purity: >99.99%
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BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)
RM0.00 MYR
Sale price
RM0.00 MYR
Regular price
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BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)
SKU: bifeo3-target-99-99-3-dia-x-0-125-thick-bond-to-coppercu-backing-plate0-111-thick
Price: RFQ
