Description
Aluminum Metallic Film
- Film coated by E-beam evaporation under vacuum below 1xE-6 torr
- evaporation rate: 0.2 nanometer per second
- Aluminum Thickness: 3 microns
- Film Crystallinity: Weak (111) - oriented polycrystals
Silicon Wafer Specifications:
- Conductive type: Si N- type As-doped
- Resistivity: <0.005 ohm-cm
- Size: 4" diameter x 0.525 mm th
- Orientation: (100) +/- 0.5o
- Polish: One sides polished
- Surface roughness: Prime
- Packing: Vacuum packed on a 4" single wafer carrier
- Optional: you may need tool below to handle the wafer ( click picture to order )
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