Description
- Diamond Lapping Film consists of precision graded diamond particles resin bonded to a flat, uniform polyester film backing. It provides excellent edge retention and maintains coplanarity regardless of varying materials or hardness within the sample. Typically it is used for unencapsulated cross-sectioning, TEM wedge/plan-view polishing, backside polishing and pre-FIB sample thinning
- Pressure-sensitive adhesive (PSA) backing for easy operation
- Diamond grit is selectable at 0.1, 0.25, 0.5, 1.0, 3.0, 6.0, 9.0, 15 and 30 micron per piece
- Fit to MTI Unipol-802 polishing machine