Description
Specification
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Growing Method: VGF
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Orientation: (100) +/-0.4 Deg.
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Wafer Size: 100mm dia x 400 microns
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Surface Polishing: Two sides polished
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Surface roughness: < 8 A ( by AFM)
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Doping: Ga Doped
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Conductor type: P-type
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Carrier Concentration: (0.64-6.67) x10^18 /c.c
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EPD: <500 /cm
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Resistivity: 0.0038-0.0158 ohm.cm (If you would like to measure the resistivity accurately, please order our Portable 4 Probe Resistivity Testing Instrument.)
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Ra(Average Roughness) : < 0.4 nm
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Package: under 1000 class clean room
Typical Properties:
- Structure: Cubic, a = 5.6754 A
- Density: 5.323 g/cm3 at room temperature
- Melting Point: 937.4 oC
- Thermal Conductivity: 640


