Description
| Plastic Foam Module Wafer Carrier is a solution for valued and fragile devices. This packing is designed to protect delicate parts during transport, processing, inspection and assembly. Also it has been applied largely in many fields like optical materials, opto-electonic components, semiconductor, and optical communication. The structure consists of three cushions, the middle cushion called module cushion can be customized to specific shape to hold the devices exactly and safely. The inner foam is made with anti-static IXPE Conductive Foam. The top plastic case is made with polycarbonate, while the bottom plastic case is made with ABS. |
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Specifications: Type: SP4-8512T/BK-H Outside Dimension: 85mm L x 85mm W x 12mm H Inside Dimension: 80mm L x 80mm W x 8mm H Transparent cover capacity height = 3.92mm Black bottom capacity height = 4.35mm Color of Cover/ Background: Trans / Black |
Round Wafer Carriers
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Membrane Film Boxes
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Vacuum Storage Chambers
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Cutting / Dicing Saws |
Crystal Substrate A-Z
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