LaAlO3, (110) 5x5x0.5 mm substrate, one side Epi polished

Substrate Specifications:

• Wafer Size:     5 x 5 x 0.5 mm thickness +/-0.05 mm
• Wafer Orientation:   (110) +/-0.5 Deg 
• Polishing:   One side CMP polished with free sub-surface damaged
  
• Surface finish (RMS or Ra) :  < 15A
• Package:    Under 1000 class clean room, and in 100 grade plastic bag in a wafer container.

LSAT	LaAlO3	GGG	NdCaAlO4	YSZ	SrTiO3
SrLaAlO4	NdGaO3	Crystal Substrate A-Z	Round Wafer Carriers	RTP Furnaces	Film Coaters