Description
Diamond wire cutting is a state of the art technology to slice single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contaimination free coolant during crystal cutting. Through several years of effort, finally, MTI provides market a quality diamond wire with reasonable price.
| Part Number |
EQ-DW035x80 or EQ-DW035x150 |
| Tensile Strength |
140 N |
| Features |
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