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4"Dia ° 0.014" (0.35 mm) thick ° 0.5" arbor Sintered Full Diamond Cutting Blades (Coarse grade 63 micron) - EQ-DF0403C
  • 4"Dia ° 0.014" (0.35 mm) thick ° 0.5" arbor Sintered Full Diamond Cutting Blades (Coarse grade 63 micron) - EQ-DF0403C
4"Dia ° 0.014" (0.35 mm) thick ° 0.5" arbor Sintered Full Diamond Cutting Blades (Coarse grade 63 micron) - EQ-DF0403C

4"Dia ° 0.014" (0.35 mm) thick ° 0.5" arbor Sintered Full Diamond Cutting Blades (Coarse grade 63 micron) - EQ-DF0403C

SKU: 4dia-0-014-0-35-mm-thick-0-5-arbor-sintered-full-diamond-cutting-blades-coarse-grade-63-micron-eq-df0403c

Price: RFQ

Specifications

 MTI supplies high quality sintered diamond blades for precision cutting or dicing of various crystals and crystalline oxides . MTI diamond blade is hot pressed and sintered by full diamond powder which provides five times longer service life than that of regular edge sintered diamond blades. The full diamond sintered blade is suitable for low speed cutting ( under 1000 RPM) of crystalline oxides or any brittle crystals, specially for cutting plastics, polymer component, metals, alloys, and bones. It is perfect to match MTI 150 low speed saw or other brand of low speed saw. SPECIFICATIONS: Part Number DF0403C Blade Diameter 100 mm  +/-0.5 mm Blade Thickness 0.35 mm +/-0.005mm Arbor 0.5" Diamond particle grit 250 mesh ( 63 micron)

Part Number DF0403C
Blade Diameter 100 mm  +/-0.5 mm
Blade Thickness 0.35 mm +/-0.005mm
Arbor 0.5"
Diamond particle grit 250 mesh ( 63 micron)

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